Thursday, November 24, 2011

F32 Wet Etch Process Engineer Vacancy | Intel Careers

F32 Wet Etch Process Engineer - 605282


Job Description

Fab 32 is looking for highly motivated individuals with strong technical background and capabilities to sustain, ramp, and transfer technologies using state of the art equipment and materials in the Wet Etch area. Prefer with experience in Plasma etch, physics. They will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous CE! (Copy exactly) and best tool matching within the Intel factory network. Job duties include sustaining ownership of day-to-day operations, equipment troubleshooting and mentoring technicians across all shifts to deliver best-in-class results for tool availability, cycle time, defects and parametric performance. Hands-on participation with frequent factory floor presence is expected. The job also includes developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools as well as developing strategy to prevent the problem from recurring in future. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Behavioral traits for this position include good communication skills, self-direction, integrity, good teamwork as well as leadership skills, strong problem solving, and attention to detail.


You must possess the minimum qualifications to be initially considered for this position. Experience would be obtained through your graduate level research and/or relevant job/internship experiences:

MS or PhD in Chemical Engineering, Electrical Engineering, Material Science, Microelectronics Engineering, Mechanical Engineering, Optical Engineering, Chemistry or Physics. Bachelors level only candidates will not be considered for this position.
-Must be able to work modified shifts as needed to support Intel business needs.
-Must be able to temporarily relocate to another Intel site for technology transfer training.
-2+ yrs exposure to one or more semiconductor processes. (Thin Films, Diffusion, Planar, Implant, Litho, Etch and/or Metrology)

Preferred Qualifications:
-1+ yrs experience with design of experiments (DOE) principles.
-2+ yrs experience in data analysis. (examples include: JMP, SPC, MatLab, Mathematica)
-4+ yrs experience in one or more semiconductor processes. (Thin Films, Diffusion, Planar, Implant, Litho, Etch and/or Metrology)
-unrestricted right to work in the US without requiring sponsorship.

Job Category: Engineering

Primary Location: USA-Arizona, Phoenix

Full/Part Time: Full Time

Job Type: Recent College Graduate

Regular/Temporary: Regular

Posting Date: Nov 22, 2011

Apply Before: Dec 31, 2011

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.

Posting Statement: We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.

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